1 Hour Ago One of the interesting elements in NBase-T networking is how and when companies are releasing new multi-gig 2.5G+5G+10G controllers to the market. This week Buffalo lifted the lid their newest card, which is using a unique controller implementation we’ve not seen in the wild before.
2 Hours Ago It has been over a year since Intel launched its Skylake-X processors and Basin Falls platform, with a handful of processors from six-core up to eighteen-core.
Yesterday At AMD’s Next Horizon event this week, the company disclosed for the first time the layout of its next generation EPYC processor, the new Vega Radeon Instinct datacenter compute accelerators, as well as a strong confidence that its execution on 7nm will be a big win.
Yesterday The Frontera supercomputer is the next generation high performance machine set to debut at the Texas Advanced Computing Center (TACC). As part of Intel’s HPC Forum, being held just before the annual Supercomputing conference, a number of disclosures about the design of Frontera (Spanish for ‘Frontier’) were made.
Yesterday One of the announcements from last week involved Intel and its new Cascade Lake Advanced Performance category of processors to launch next year. These new processors will be based on combining two 24-core Cascade Lake-SP processors on a single package substrate to offer a single socket 48-core option with a total of twelve memory channels.
3 Days Ago One of the interesting things to come out of the news in recent weeks is the march to double capacity memory. In today’s market, memory modules for consumer grade computers have a maximum of 16GB per module.
3 Days Ago One of the recent topics permeating through the custom PC space recently has been about power draw. Intel’s latest eight-core processors are still rated at a TDP of 95W, and yet users are seeing power consumption north of 150W, which doesn’t make much sense.
7 Days Ago On the back of a series of recent announcements regarding Intel’s future product line and portfolio, Intel has disclosed to us that it will be holding a forward-looking Architecture Summit/Event in a few weeks.
7 Days Ago AMD's 2019 is set to be full of 7nm products, and on the back of AMD's New Horizon event on 2016, today it is hosting part two: Next Horizon.
7 Days Ago Despite having officially launched back in July, Intel’s Xeon E desktop platform has yet to see the light of day in systems casually available to users or small businesses.
8 Days Ago Ahead of the annual Supercomputing 2018 conference next week, Intel is today announcing part of its upcoming Cascade Lake strategy. Following on from its server-focused Xeon Scalable Skylake family, Intel has already pre-announced that Cascade Lake-SP will form the next generation, with a focus on compute and security.
15 Days Ago This year AMD launched its second generation high-end desktop Ryzen Threadripper processors. The benefits of the new parts include better performance, better frequency, and parts up to 32 cores.
15 Days Ago Reports of a new Carrizo APU have been floating around for the past couple of weeks as several ASRock FM2+ recently had BIOS updates stating ‘now supporting new Carrizo APU’.
18 Days Ago This week Microsoft released a new blog dedicated to the Windows Kernel internals. The purpose of the blog is to dive into the Kernel across a variety of architectures and delve into the elements, such as the evolution of the kernel, the components, the organization, and in this post, the focus was on the scheduler.
19 Days Ago One of the telling conclusions from our original 32-core AMD Ryzen Threadripper 2990WX review was that because of the arrangement of cores and memory, performance in most applications did not scale from the 16-core, and in some cases regressed.
19 Days Ago In our series of Best CPU guides, here’s the latest update to our recommended Gaming CPUs list. All numbers in the text are updated to reflect pricing at the time of writing.
20 Days Ago In the upper echelons of commercial workhouses, having access to copious amounts of local NVMe storage is more of a requirement than ‘something nice to have’.
20 Days Ago The process of AMD ramping up its EPYC efforts involves a lot of ‘first-step’ vendor interaction. Having been a very minor player for so long, all the big guns are taking it slowly with AMD’s newest hardware in verifying whether it is suitable for their workloads and customers.
25 Days Ago Intel’s newest line of desktop processors bring with them a number of changes designed to sway favor with performance enthusiasts. These new parts bring Intel’s consumer processors up to eight cores, with higher frequencies, better thermal connectivity, and extra hardware security updates for Spectre and Meltdown.
27 Days Ago News today from OregonLive, a reputable source on news out of Intel, has posted that Intel is set to reorganize its manufacturing group. Spurred by the retirement of Sohail Ahmed next month, who has led the group since 2016, the Technology and Manufacturing Group will be split between the Technology Development, Manufacturing and Operations, and the Supply Chain.
28 Days Ago In the process of describing new features for the Mate 20 and Mate 20 Pro, the comments on one of the slides let slip that Huawei is set to announce a new Matebook this November.
28 Days Ago New to the market is the latest flagship smartphone from Huawei. Following the Mate series, last year’s Mate 10 and Mate 10 Pro are succeeded by the Mate 20 and the Mate 20 Pro, featuring the 7nm Hisilicon Kirin 980 chipset and whole new design with added features.
28 Days Ago After announcing the Kirin 980 at IFA, built on the latest TSMC process and latest ARM cores, today Huawei is opening the book on the Mate 20 series of devices which will be the Flagship brand for the company in this smartphone generation.
29 Days Ago One of today’s announcements threw up an interesting footnote worthy of further investigation. With its latest products, HP announced that their mainstream desktop platforms would be shipped with up to 32GB of memory, which was further expandable up to 128GB.
32 Days Ago One of the prominent parts of Intel’s announcement this week for the new 9th Generation core processors was that both the overclockable consumer processors and the new high-end desktop processors all feature a soldered thermal interface material (STIM) between the silicon die and the heatspreader.